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References

1
Delphi-Collaboration, G. Anzivino et al., Nucl.Instr. Meth. A263 (1988) 215.
2
Aleph-Collaboration, G. Batignani et al., Nucl. Instr. Meth. A315 (1992) 121 and CERN-PPE/95-017 submitted to Nucl. Instr. Meth.
3
Opal-Collaboration, P. Allport et al., Nucl. Instr. Meth. A324 (1993) 34 and Nucl. Instr. Meth. A346 (1994) 476.
4
CDF-Collaboration, B. Barnett et al., Nucl. Instr. Meth. A315 (1992) 121, D. Amidei et al., Nucl. Instr. Meth. A342 (1994) 252, and Nucl. Instr. Meth. A350 (1994) 73;
S. Tkaczyk et al., Nucl. Instr. Meth. A342 (1994) 240.
5
Mark II-Collaboration, C. Adolphsen et al., Nucl.Instr. Meth. A313 (1992) 63.
6
L3-Collaboration,
M. Acciarri et al., CERN-PPE/94-122 , and Nucl. Instr. Meth. A360 (1995) 103.
7
A prototype version with 12 channels (APC12) has been described in:
R. Horisberger and D. Pitzl, Nucl. Instr. Meth. A326 (1993) 92.
8
J. Bürger et al., Technical proposal to build silicon tracking detectors for H1, H1 internal report 226 (1992) and DESY PRC92/01;
D. Pitzl et al., IEEE Nucl. Science Symp. 1992, unpublished.
9
O. Adriani et al., Nucl. Instr. Meth. A342 (1994) 181.
10
E. Gatti, P.F. Manfredi and V. Speziali, Nucl. Instr. Meth. 226 (1984) 1163,
M. Leone et al., Nucl. Instr. Meth. A333 (1993) 519.
11
D. Pitzl et al., Nucl. Instr. Meth. A348 (1994) 454
C.S.E.M. SA, CH 2007 Neuchâtel, Maladière 71, Case Postale 41, Switzerland.
12
J. Bürger et al., Proc. Wire Chamber Conference Vienna, 1995 and DESY 95-049.
13
Faselec AG, Philips Semiconductor, Binzstr. 44, CH 8045 Zürich, Switzerland.
14
W. Erdmann and S. Streuli; Swiss Patent Nr 3026/94-2.
15
Huber & Suhner, Degersheimerstr. 14, CH 9100 Herisau, Switzerland.
16
Ciba Geigy, CH 4000 Basel, Switzerland.
17
Polyscience AG, Riedstr. 13, CH 6330 Cham, Switzerland.

  figure112
Figure:   Half shell of the Central Silicon Tracker of H1.

  figure118
Figure:   p-side of the hybrid made from 635 tex2html_wrap_inline420 m tex2html_wrap_inline424 . Left: Five preamplifier chips (APC128). Low center: Decoder Chip.

  figure124
Figure:   Schematic layout of the electrical and optical readout and control.

  figure130
Figure:   Simplified diagram of APC128 chip.

  figure135
Figure:   Layout of Decoder Chip.

  figure140
Figure:   Circuit diagram of the input stages of the decoder chip. The capacitors are external to the decoder chip.

  figure146
Figure:   Circuit diagram of the electrical-optical converters. Left: Analog signal driver situated on the hybrid (with the exception of the LED). Power consumption 50 mW. Right: Digital signal driver situated 34 m apart from the detector.

  figure152
Figure:   Circuit diagram of the optical-electrical converters. Left: Analog signal receiver situated 34 m apart from the detector. Right: Digital signal receiver situated on a printed circuit at the end of the detector. Power consumption 250 mW.

  figure158
Figure:   Distribution of measurements of a reference voltage (2V) transmitted through the optical readout chain and digitised with a 12 bit FADC. The distribution is purely Gaussian with an r.m.s of 2.9 bits. For comparison: Signals from the APC128 have a noise contribution of 32 bits.

  figure162
Figure:   Pair of optical multiconnectors (left) and enlarged view of the central part with fibers glued in (right).

  figure168
Figure:   Left: Housing for diode. Right: fiber end.



Markus Kausch
Tue Jun 25 14:34:46 MST 1996