CIP

 

	Soldering of micro-coax cables for pad readout
	Signal fan-in on a 128 pin connector, 0.5 mm pitch
	Fill with Araldit glue
	First complete pad layer
	First 4 layers in bake-out oven
	Transfer wires from a wiring frame to the chamber
	Test of the prototype chamber
	3D view of the CIP end flange with on-chamber electronics, gas, and HV connectors
	Readout schematics
	CIPIX readout board, 1999 prototype
	Protoype with optical hybrid and cable
small	Pair of final CIPIX boards with multi-layer high-speed Kapton bridge. Chips are covered with epoxy to protect bond wires. Optical hybrid not yet fully assembled.
small	Optical hybrid, chamber side
small	Driver chip
small	6 GaAs VCSEL vertical cavity surface emitting laser diodes for digital and analog data and 2 pin diode receivers for clock signals
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	Optical connector with 8 fibers ending in a 90 degree bend
	Receiver and de-multiplexer schematics
small	Receiver card
small	Optical hybrid, receiver end
small	Receiver chip
small	receivers between holes for alignment pins
small	2 VCSELs for clock signals, 6 pin diode receivers
small	CIPIX board series production
small	Finished CIP chamber under HV test
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small	Connectors from pad coax cables to CIPIX cards
small	+z end: 5 layers expand freely
	8.2.2001 System test at Zürich with 2 boards in layer 3
	Building 5-layer readout towers Mechanical test
	14.2.2001: All 80 boards mounted with gas and HV cables and 2 CIPIX board pairs fully cabled
	Each pair of CIPIX cards will have an 8-fiber optical cable (orange) a cable for control signals, and one for the low voltage supply
	Yellow grounding wires between chamber and frontend board must be as short as possible
small	17.2.2001 CIP arrives at DESY
small	Down the elevator
small	Malte Hildebrandt gives directions for Nicole Werner, Max Urban and Jan Becker
small	CIP on the installation tool
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small	Frontend electronics still to come...
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small	Kurt Bösiger and Stefan Steiner taking documentation
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small	Plexiglass guiding rails glued onto CJC CFK tank View from +z
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small	View from -z
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small	First test installation
small	Stefan Steiner taking aim
small	Watching from +z
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small	Removing the insertion tool
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small	5-layer CIP fully inserted (within 1 mm in z). Test with FST contact ring was next. Successful
small	Test of the support for the electronics installation. Allows full rotation of the chamber.
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